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Jet Scrubber - List of Manufacturers, Suppliers, Companies and Products

Jet Scrubber Product List

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Jet scrubber machine

Future ultra-thin plate products can be accommodated! The nozzle unit position is designed at an oblique angle with two sets at the top and two sets at the bottom.

This product is a jet scrubber machine that applies a wide 12mm disk and a roller spacing of 25mm pitch. It is designed to enable the transfer and processing of ultra-thin sheet products with a minimum thickness of 0.06mm (core). It will be capable of handling ultra-thin sheet products in the future. 【Features】 ■ The nozzle unit positions are designed at an angle with 2 sets on the upper part and 2 sets on the lower part. ■ Uniform spraying is possible. ■ The drive unit is designed for easy maintenance and repair. ■ The spicoron is designed in a B-type two-row parallel system to achieve maximum recovery rate. ■ A cover method using PVC piping is applied instead of the existing cable tie method. ■ Easy maintenance. *For more details, please refer to the PDF materials or feel free to contact us.

  • Wafer processing/polishing equipment

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Wafer Jet Scrubber

Supports single wafers and wafer rings! With the addition of a dedicated nozzle, it is possible to apply surfactants.

We would like to introduce our "Wafer Jet Scrubber," which performs high-speed cleaning using only pure water. We offer a lineup including the "WJS-150B," as well as the "WJS-200B" and "WJS-300B." Additionally, it can accommodate various processes such as single wafers, wafer rings (half-cut, full-cut, expand), and more. 【Features】 ■ High-speed cleaning using only pure water ■ Compatible with various processes ■ With the addition of a dedicated nozzle, surfactants (neutral/weak alkaline) can be applied during brush cleaning ■ An optional brush pressing pressure mechanism can be installed *For more details, please refer to the related links or feel free to contact us.

  • Other cleaning machines

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Wafer High-Pressure Jet Scrubber HPC-8654-H

【Demo unit available for loan!】Wafer High-Pressure Jet Scrubber HPC-8654-H

It is a method for cleaning the wafer surface with a high-pressure jet of pure water in a non-contact manner. 【Features】 ◯ Removal of particles ◯ Removal of particulate contamination ◯ Removal of burrs from the wafer surface

  • Wafer processing/polishing equipment
  • Wafer

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